Description

• Compact DIPIPM
-The packaging ensures the same insulation distance as traditional small DIPIPMs

-Compared to small DIPIPMs, the bottom area is significantly reduced while ensuring the same insulation distance. It achieves low-temperature operation at -40°C, supports use in cold regions, and promotes flexibility in air conditioning equipment design as well as power semiconductor modules with reduced environmental burden
• – Due to the inclusion of RC-IGBT, the footprint is reduced by approximately 53% compared to the compact DIPIPM series
– Transfer molding structure that achieves both heat dissipation and insulation through a high thermal conductivity insulating plate
– Achieving a more compact design than traditional small-sized DIP IPMs, thereby saving space on the inverter circuit board
– Implement the design of the inverter circuit board by equipping with an interlocking function for arm short-circuit protection
The lower limit of continuous operating temperature is -40°C, making it suitable for a wide range of usage environments, including cold regions