Description

• Topology: H6.5
• Voltage: 650 V
• Current: 100 A
• Chip Technology: IGBT fast
• Status: Series
• Pack Quantity: 100
• Isolation: Base isolation: Al2O3
• Description: H6.5: H6.5; Kelvin Emitter for improved switching performance; Temperature sensor
• Description: IGBT fast – High efficiency in hard switching and resonant topologies; High speed switching; Low gate charge
• PCB Connection: 4 towers
• Dimensions: 82 mm x 37.4 mm
• Height: 12 mm
• Pin Type: Solder pin