Product Naming Convention
Bronze Technologies uses a systematic naming convention for its gate driver products. Understanding the naming convention helps identify product features and capabilities at a glance.
Driver Core Naming
Driver core model numbers follow the pattern: [Channels]Q[Type][Current][Voltage]-[Series]
| Code | Meaning |
|---|---|
| 2Q | Dual-channel driver |
| 1Q | Single-channel driver |
| 6A | Six-channel driver |
| D | Driver core |
| P | Single module driver (Plug-in) |
| C | Custom/Special driver |
| T | Test equipment |
| BTD | Isolated driver chip |
| BTL | Low-side driver chip |
Model Number Examples
| Model | Decoding |
|---|---|
| 2QD30A17K-I-xx | 2-channel (2Q) Driver core (D) 30A peak current 1700V voltage rating I-series |
| 1QP0635V(S)xx | 1-channel (1Q) Plug-in driver (P) 06A current 3500V voltage rating |
| 2QP0335V33-LV100 | 2-channel Plug-in driver 3300V for LV100 package |
| BTD25350 | Isolated Driver chip (BTD) 25A peak current 3500V isolation |
| BTL2752x | Low-side Driver chip (BTL) 2-channel 7.5A peak |
| QTJ8600T | Test system (QTJ) 8600 series Test equipment (T) |
Package Designations
Package designations in model numbers indicate the compatible power module package type:
| Package | Description |
|---|---|
| EconoDual | Economic dual IGBT module package |
| EconoDual 3 | Third generation EconoDual package |
| PrimePack | PrimePack IGBT module package |
| PrimePack 3+ | Enhanced PrimePack 3 package |
| XHP | XT high power package |
| LV100 | Low-voltage 100mm package |
| IHM | Industrial high-power module |
| 62mm | 62mm standard package |
| Press-pack | Press-pack device package |
| SOP-8 | Small outline package 8-pin |
| SOW-18 | Small outline wide 18-pin |
