Recently, the 3600A/4500V Press-Pack IGBT and Key Technologies
- Currently, the high-capacity press-pack IGBT modules developed by CRRC Times Electric have passed the demonstration application verification tests at the flexible HVDC converter valve level of multiple power grid enterprises, meeting the requirements for mass production and engineering application. In response to the mass production demand for press-pack IGBT devices, CRRC Times Electric has completed the layout planning and initial construction of the pilot production line for press-pack IGBTs, expected to be completed in the first quarter of 2018.
- Press-pack IGBTs are similar in appearance to thyristors and other devices, but internally they achieve power capacity by connecting numerous components called “sub-units” in parallel. The electrical connection between the chip and the electrode is not achieved through conventional leads or welding methods, but through pressure.
- Compared with traditional welded IGBT modules, press-pack IGBT modules have ultra-large capacity and advantages such as high reliability and failure short-circuit mode. Therefore, currently, press-pack IGBT devices are mainly used in high-end equipment industries such as flexible HVDC transmission, large industrial drives, and energy.
- With the development of application fields such as large-scale distributed renewable energy integration, offshore wind farm grid connection and transmission, and new urban power grid construction, the market demand for press-pack IGBT modules is growing rapidly. Industry insiders estimate that in the next five years, the global market size of flexible HVDC transmission will reach over 100 billion yuan, representing a huge market scale.
- However, limited by conventional chip and press-pack packaging technology, currently only a few manufacturers in Europe, Japan, and other regions have high-capacity press-pack IGBT device products.
- Over the years, CRRC Times Electric has adhered to independent technological innovation and has established power semiconductor R&D centers in both Zhuzhou, China and Lincoln, UK, jointly promoting the R&D of advanced IGBT design and process technology. The company independently designed and built the world’s first 8-inch high-voltage IGBT chip professional production line, overcoming key technologies and complete processes for high-voltage IGBT manufacturing. In addition, CRRC Times Electric has built a complete industrial chain of domestic IGBT “chip – module – device – application.”
- The 3600A/4500V press-pack IGBT module developed by CRRC Times Electric is the product with the largest capacity currently visible on the market, and it has double-sided heat dissipation and long-term stable failure short-circuit capability. It has achieved the leap from “nothing to something” in domestic high-capacity press-pack IGBT technology, once again realizing the breakthrough of the “Chinese chip” in high-end equipment manufacturing.
