Isolated Gate Driver Chips

Isolated gate driver chips provide compact, integrated solutions for driving IGBT and SiC power devices. These chips combine signal isolation, gate drive amplification, and protection functions in a single package, making them ideal for space-constrained applications.

Low-Side Driver Chips

Low-side driver chips are designed for non-isolated gate drive applications where the driver ground is shared with the power device ground. These chips typically feature dual independent channels, Schmitt trigger inputs for noise immunity, and peak current capabilities up to 5A.

Package Options

Isolated driver chips are available in various package types to suit different application requirements:

• SOP-8 – Compact surface mount package for low-power applications
• SOP-16 – Standard surface mount for multi-channel drivers
• SOW-8 – Wide-body surface mount with enhanced creepage
• SOW-14 – Wide-body for dual-channel isolated drivers
• SOW-16 – Wide-body package for high-isolation applications
• SOW-18 – Large wide-body package for high-power drivers

Application Areas

Isolated and low-side driver chips are used in a wide range of power electronics applications:

• Motor drive systems for industrial automation
• Charging stations for electric vehicles
• Communication power supplies
• New energy vehicle power supplies
• UPS (Uninterruptible Power Supply) systems
• DC/DC isolated power supplies
• Solar inverters and industrial converters
• Battery management systems

Protection Features

Modern driver chips integrate multiple protection functions to ensure safe operation:

• Short circuit protection with fast response time
• Under-voltage lockout (UVLO) for gate drive supply
• Over-temperature protection with thermal shutdown
• Active Miller clamp to prevent false turn-on
• Desaturation detection for IGBT protection
• Fault output signal for system-level monitoring