Description

• Topology: Three-level ANPC
• Voltage: 1200 V
• Current: 450 A
• Chip Technology: IGBT4 HS
• Status: Series
• Pack Quantity: 36
• Isolation: Base isolation: Al2O3
• Description: Three-level ANPC: Temperature sensor; Advanced Neutral Point Clamped topology; Split output for improved switching performance; Split topology
• Description: IGBT4 HS – Easy paralleling; High speed switching; Low switching losses
• PCB Connection: 4 towers
• Dimensions: 107.2 mm x 47 mm
• Height: 12 mm
• Pin Type: Solder pin