Description

• Topology: Sixpack
• Voltage: 1200 V
• Current: 200 A
• Chip Technology: IGBT4 HS
• Status: Series
• Pack Quantity: 24
• Isolation: Base isolation: IMB
• Description: Sixpack: Inverter; Kelvin Emitter for improved switching performance; Tandem inverter diode; Temperature sensor
• Description: IGBT4 HS – Easy paralleling; High speed switching; Low switching losses
• PCB Connection: 4 towers
• Dimensions: 122 mm x 62 mm
• Height: 17 mm
• Pin Type: Solder pin