Description

• Automotive SiC / Si Power Module
-With its compact size and rich product lineup, it supports multiple types of xEVs, extends the driving range, and contributes to improving power consumption. Now, miniaturization of xEV inverters has become possible, and the J3-T-PM*1, J3-HEXA-S, and J3-HEXA-L series support inverter designs of various capacities.
• – Compared to existing products, the module size has been reduced by approximately 60%*2, which will facilitate the realization of smaller xEV inverters• There are two types of semiconductor devices: SiC-MOSFET and RC-IGBT (Si).
– The SiC-MOSFET adopts a trench type, resulting in low loss
– RC-IGBT (Si) adopts a novel structure where IGBT and FWD (free-wheeling diode) are integrated on a single chip.
– A rich product lineup based on the J3-T-PM combination*3 supports various xEV inverter designs